The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Oct. 18, 2017
Applicant:

Telefonaktiebolaget Lm Ericsson (Publ), Stockholm, SE;

Inventors:

Anatoli Deleniv, Mölndal, SE;

Ola Tageman, Gothenburg, SE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/208 (2006.01); H01P 7/06 (2006.01); H01Q 15/24 (2006.01); H01Q 19/00 (2006.01); H01Q 21/00 (2006.01);
U.S. Cl.
CPC ...
H01P 1/2088 (2013.01); H01P 7/06 (2013.01); H01Q 15/24 (2013.01); H01Q 19/005 (2013.01); H01Q 21/005 (2013.01);
Abstract

A filter arrangement having three or more stacked metallization layers separated by printed circuit board, PCB, layers. Each metallization layer includes an aperture. The filter arrangement has a plurality of via-holes extending though the stacked metallization layers and through the separating Dielectric material layers, whereby the via-holes and the metallization layers delimit a cavity in each Dielectric material layer. The cavities in two consecutive Dielectric material layers being coupled by the aperture in the single metallization layer separating the two consecutive Dielectric material layers. The aperture of a topmost metallization layer being arranged as antenna element. The filter arrangement having a signal interface arranged as a conduit connecting at least one dielectric material layer to an exterior of the filter arrangement.


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