The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Dec. 19, 2018
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Kota Kimura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/45 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0696 (2013.01); H01L 29/41708 (2013.01); H01L 29/456 (2013.01); H01L 29/7397 (2013.01);
Abstract

A semiconductor device according to the present invention includes a substrate having an IGBT region, a diode region, and a high resistance region between the IGBT region and the diode region, a first electrode provided on an upper surface of the substrate and a second electrode provided on a back surface as a surface on an opposite side to the upper surface of the substrate, wherein in the high resistance region, a contact resistance between the upper surface of the substrate and the first electrode or a contact resistance between the back surface of the substrate and the second electrode is higher than in the diode region, and a width of the high resistance region is equal to or greater than a thickness of the substrate.


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