The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Jul. 21, 2020
Applicant:

Lumileds Llc, San Jose, CA (US);

Inventors:

Tze Yang Hin, Cupertino, CA (US);

Seng Huat Lau, Bayan Lepas, MY;

Hideo Kageyama, Santa Clara, CA (US);

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 25/16 (2006.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 25/167 (2013.01); H01L 25/18 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/62 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92127 (2013.01);
Abstract

Methods of manufacturing light-emitting devices are described herein. A method includes obtaining a packaging substrate. The packaging substrate includes an embedded metal inlay, vias in the packaging substrate and contacts on a bottom surface of the packaging substrate, each electrically coupled to a respective one of the vias. The method also includes forming a hybridized device, attaching a bottom surface of the hybridized device to a top surface of the metal inlay, and wirebonding a top surface of the hybridized device to a stop surface of the packaging substrate using a plurality of conductive connectors.


Find Patent Forward Citations

Hin, Tze. (2022). Methods of manufacturing light-emitting devices with metal inlays and bottom contacts (U.S. Patent No. 11373991). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11373991

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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