The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Jan. 17, 2018
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Yuji Kiyota, Kanagawa, JP;

Takahiro Takeda, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/58 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/585 (2013.01); H01L 23/60 (2013.01); H01L 24/06 (2013.01); H01L 2223/6627 (2013.01); H01L 2924/19032 (2013.01); H01L 2924/19033 (2013.01);
Abstract

The present technology relates to a semiconductor chip that can ensure a low impedance current path in an I/O ring while suppressing attenuation of radio frequency signals. The semiconductor chip includes an I/O ring surrounding a core circuit, first and second pads serving as input/output terminals for radio frequency signals, and a radio frequency signal transmission line electrically connected to the first and second pads and the core circuit. The radio frequency signal transmission line is formed above the I/O ring. The present technology is applicable to a semiconductor chip that performs input and output of RF signals.


Find Patent Forward Citations

Loading…