The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Apr. 20, 2020
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Myung Lim Ryu, Suwon-si, KR;
Kwang Ju Choi, Suwon-si, KR;
Da Un Kim, Suwon-si, KR;
Duck Whan Kim, Suwon-si, KR;
Dong Hyeon Lee, Suwon-si, KR;
Kyoung Min Kim, Suwon-si, KR;
Ik Su Shin, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Abstract
An electronic component module includes: a substrate; an electronic element disposed on a first surface of the substrate; an encapsulant disposed on the first surface of the substrate and configured to seal the electronic element; a first pad disposed on an outermost region of a second surface of the substrate; a second pad disposed inward of the first pad on the second surface of the substrate, and positioned parallel to the first pad; and a shielding layer connected to the first pad, and at least partially surrounding a side surface of the encapsulant and a side surface of the substrate. The first and second pads are electrically connected by a connection pad.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile