The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Apr. 16, 2020
Applicant:
3d Glass Solutions, Inc., Albuquerque, NM (US);
Inventors:
Mark Popovich, Placitas, NM (US);
Roger Cook, Albuquerque, NM (US);
Jeb H. Flemming, Albuquerque, NM (US);
Sierra D. Jarrett, Albuquerque, NM (US);
Jeff Bullington, Orlando, FL (US);
Carrie F. Schmidt, Las Lunas, NM (US);
Luis C. Chenoweth, Albuquerque, NM (US);
Assignee:
3D Glass Solutions, Inc., Albuquerque, NM (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/15 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/4846 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/49838 (2013.01);
Abstract
A method of batch massively parallel die release of a die from a substrate enabling low cost mass production of with passive, system in package (SiP) or system-in-a-package, or systems-on-chip (SoC), filters and/or other devices from a glass substrate.