The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Sep. 25, 2017
Applicant:

3dt Holdings, Llc, San Diego, CA (US);

Inventors:

Ghassan S. Kassab, La Jolla, CA (US);

Zachary Berwick, San Diego, CA (US);

Matthew J. Phillips, Carlsbad, CA (US);

Peter J. D'Aquanni, Murrieta, CA (US);

Assignee:

3DT Holdings, LLC, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/04 (2006.01); A61B 5/0538 (2021.01); A61B 5/01 (2006.01); A61M 25/09 (2006.01); A61L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01B 7/048 (2013.01); A61B 5/0538 (2013.01); A61B 5/01 (2013.01); A61B 2562/125 (2013.01); A61B 2562/222 (2013.01); A61L 29/08 (2013.01); A61L 2420/02 (2013.01); A61L 2420/08 (2013.01); A61M 25/09 (2013.01);
Abstract

Methods to generate elongated wires having a metallic substrate thereon and devices comprising the same. In a method of generating a device, the method comprises the steps of applying a first nonconductive coating upon an elongated core body of the device; applying a first conductive coating upon the first nonconductive coating; applying a photoresist coating upon the first conductive coating; directing a laser/light from a laser/light source upon portions of the photoresist coating to cause said portions of the photoresist coating to harden; applying a first chemical to the photoresist coating to remove the photoresist coating that was not hardened by the laser/light; and applying a second chemical to the hardened photoresist coating to expose portions of the first conductive coating previously positioned below the hardened photoresist coating.


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