The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Jun. 04, 2019
Applicant:
Shorin Industry Co., Ltd., Hyogo, JP;
Inventors:
Masahito Yoshida, Osaka, JP;
Taisuke Shimazu, Kyoto, JP;
Yoshihiro Kodama, Kyoto, JP;
Yoshikazu Koyama, Hyogo, JP;
Kunio Tabata, Hyogo, JP;
Assignee:
SHORIN INDUSTRY CO., LTD., Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G21F 1/10 (2006.01); G21F 3/02 (2006.01); B32B 5/26 (2006.01); B32B 5/02 (2006.01); G21F 1/12 (2006.01);
U.S. Cl.
CPC ...
G21F 3/02 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); G21F 1/106 (2013.01); G21F 1/125 (2013.01); B32B 2250/02 (2013.01); B32B 2250/20 (2013.01); B32B 2255/02 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2264/105 (2013.01); B32B 2307/714 (2013.01); B32B 2437/00 (2013.01); B32B 2571/00 (2013.01);
Abstract
A tungsten sheet includes a tungsten layer. The tungsten layer includes a binder resin and a plurality of tungsten particles included in the binder resin. A tungsten composition amount of the tungsten layer is at least 70% by mass (wt %). An average particle diameter of the plurality of tungsten particles is more than 1 μm and less than 15 μm.