The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Jul. 29, 2019
Applicant:

GM Global Technology Operations Llc, Detroit, MI (US);

Inventors:

Ziqiang Sheng, Troy, MI (US);

Jounqmin Norman Goan, Troy, MI (US);

Adam R. Groseclose, Sterling Heights, MI (US);

Kleber Cabral, Auburn Hills, MI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/20 (2020.01); G06F 111/10 (2020.01); G06F 119/18 (2020.01);
U.S. Cl.
CPC ...
G06F 30/20 (2020.01); G06F 2111/10 (2020.01); G06F 2119/18 (2020.01);
Abstract

Systems and methods are provided for developing and producing a die using mesh data. A mesh data file representing a surface of the die is created. The mesh data file is configured in an original format that is one of a point-facet format or a node-element format. The mesh data file is translated into a translated format that is another of the point-facet format or the node-element format. Prior to building, the die, as represented by the mesh data file, is evaluated virtually.


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Sheng, Ziqiang. (2022). Method and system with mesh data conversion for stamping dies (U.S. Patent No. 11373020). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11373020

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