The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Aug. 26, 2020
Commscope Technologies Llc, Hickory, NC (US);
Mulan Huang, Jiangsu, CN;
Jin Liu, Jiangsu, CN;
Qiuliang Wang, Jiangsu, CN;
Yujun Zhang, Jiangsu, CN;
CommScope Technologies LLC, Hickory, NC (US);
Abstract
The present disclosure relates to a testing device comprising a bracket including a first groove and a second groove parallel to each other, wherein the first groove and the second groove run through an inner surface of the bracket perpendicularly to a thickness direction of the testing device; a plate assembly including a first plate and a second plate parallel to each other, wherein the first plate is disposed within the first groove and fits closely within the first groove along a length direction and a thickness direction of the testing device, the second plate is disposed within the second groove, with a gap present in the second groove along a length direction and/or a thickness direction of the testing device; a connector array including a plurality of connector assemblies disposed on the plate assembly in a predetermined pattern, wherein each of the plurality of connector assemblies is connected between the first plate and the second plate; and a displacing tool disposed on the bracket and/or the plate assembly and configured to displace the second plate relative to the first plate within the second groove along a length direction and/or a thickness direction of the testing device. The testing device may simulate various different axial deviations and/or angular deviations of the opposed printed circuit boards, and may be used to test the performance parameters such as low PIM, return loss and insertion loss between the printed circuit boards and the connectors under different axial deviations and/or angular deviations.