The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Apr. 26, 2019
Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Masahiro Fuda, Tokyo, JP;

Toshinori Mizuguchi, Tokyo, JP;

Junji Nakano, Tokyo, JP;

Yoshiharu Inoue, Tokyo, JP;

Kazuhisa Kusumi, Tokyo, JP;

Yasuaki Naito, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 2/08 (2006.01); C23C 2/02 (2006.01); C23C 28/02 (2006.01); C25F 1/06 (2006.01); C22C 13/00 (2006.01); C22C 38/06 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/00 (2006.01); C22C 38/42 (2006.01); C22C 38/48 (2006.01); C22C 38/50 (2006.01); C22C 38/54 (2006.01); C23C 2/06 (2006.01); C23C 2/26 (2006.01); C23C 2/28 (2006.01); B32B 15/01 (2006.01); C22C 38/58 (2006.01); C25D 5/36 (2006.01); C25D 7/06 (2006.01); C23C 28/00 (2006.01); C23C 30/00 (2006.01); B32B 15/18 (2006.01); C25D 5/50 (2006.01); B32B 15/04 (2006.01); C25F 1/02 (2006.01); C23C 2/40 (2006.01); C23C 2/04 (2006.01); C22C 38/08 (2006.01); C22C 38/18 (2006.01); C22C 38/26 (2006.01); C22C 38/28 (2006.01); C22C 38/32 (2006.01); C22C 38/20 (2006.01); C22C 38/22 (2006.01); C22C 38/16 (2006.01); C22C 38/44 (2006.01); C22C 38/46 (2006.01); C22C 38/12 (2006.01); C22C 38/24 (2006.01); C22C 38/40 (2006.01); C22C 38/14 (2006.01);
U.S. Cl.
CPC ...
C23C 2/08 (2013.01); B32B 15/01 (2013.01); B32B 15/012 (2013.01); B32B 15/013 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/18 (2013.01); C22C 13/00 (2013.01); C22C 38/00 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); C22C 38/18 (2013.01); C22C 38/20 (2013.01); C22C 38/22 (2013.01); C22C 38/24 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); C22C 38/32 (2013.01); C22C 38/40 (2013.01); C22C 38/42 (2013.01); C22C 38/44 (2013.01); C22C 38/46 (2013.01); C22C 38/48 (2013.01); C22C 38/50 (2013.01); C22C 38/54 (2013.01); C22C 38/58 (2013.01); C23C 2/02 (2013.01); C23C 2/04 (2013.01); C23C 2/06 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C23C 2/285 (2013.01); C23C 2/40 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 28/32 (2013.01); C23C 28/321 (2013.01); C23C 28/322 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C25D 5/36 (2013.01); C25D 5/50 (2013.01); C25D 7/06 (2013.01); C25D 7/0614 (2013.01); C25F 1/02 (2013.01); C25F 1/06 (2013.01); Y10T 428/1266 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/12618 (2015.01); Y10T 428/12667 (2015.01); Y10T 428/12708 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12722 (2015.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12965 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/26 (2015.01);
Abstract

A hot-dip Sn—Zn-based alloy-plated steel sheet according to an aspect of the present invention includes: a steel sheet having a predetermined chemical composition; a diffusion alloy layer provided on one surface or both surfaces of the steel sheet; and a Sn—Zn-plated layer provided on the diffusion alloy layer, in which the diffusion alloy layer contains Fe, Sn, Zn, Cr, and Ni, an area ratio of a Sn—Fe—Cr—Zn phase to a Sn—Fe—Ni—Zn phase in the diffusion alloy layer is 0.01 or more and less than 2.5, the diffusion alloy layer has a coverage of 98% or more with respect to the one surface, the Sn—Zn-plated layer contains 1% to 20% of Zn by mass % and a remainder consisting of Sn and impurities, and an adhesion amount of the Sn—Zn-plated layer is 10 to 80 g/mper one surface.


Find Patent Forward Citations

Loading…