The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Jun. 25, 2019
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Lianzhou Chen, Woodbury, MN (US);

Dmitriy Salnikov, Woodbury, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C09J 7/35 (2018.01); C08G 59/24 (2006.01); C08G 59/38 (2006.01); C08G 59/50 (2006.01); C08G 59/60 (2006.01); C08G 75/029 (2016.01); C08K 3/08 (2006.01); C08K 5/18 (2006.01); C08L 81/06 (2006.01); C08G 59/40 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/245 (2013.01); C08G 59/38 (2013.01); C08G 59/4021 (2013.01); C08G 59/5033 (2013.01); C08G 59/5073 (2013.01); C08G 59/60 (2013.01); C08G 75/029 (2013.01); C08K 3/08 (2013.01); C08K 5/18 (2013.01); C08L 81/06 (2013.01); C09J 7/35 (2018.01); C08G 2170/00 (2013.01); C08K 2003/0812 (2013.01); C08L 2205/035 (2013.01); C08L 2207/53 (2013.01); C08L 2312/00 (2013.01); C09J 2203/35 (2020.08); C09J 2463/00 (2013.01); C09J 2481/00 (2013.01);
Abstract

Provided is a curable composition containing a reactive mixture of components including an polyethersulfone having a chemical group reactive with an epoxide, a cycloaliphatic polyepoxide resin, a polyepoxide having a functionality greater than two, a liquid diepoxide resin, a first curative containing 9,9-bis(aminophenyl)fluorene or a derivative therefrom and having a curing onset temperature of from 150° C. to 200° C. The components can further comprise a second curative having a curing onset temperature of from 60° C. to 180° C. When thermally curing this composition, the second epoxy curative starts to cure before the first epoxy curative, thereby inhibiting vertical flow of the adhesive during the curing process.


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