The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Sep. 05, 2019
Applicant:
Elite Electronic Material (Kunshan) Co., Ltd., Kunshan, CN;
Inventors:
Assignee:
ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD., Kunshan, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08G 73/02 (2006.01); C08L 47/00 (2006.01); C08L 65/00 (2006.01); C08L 33/14 (2006.01); C08J 5/24 (2006.01); C08L 25/16 (2006.01);
U.S. Cl.
CPC ...
C08G 73/0233 (2013.01); C08J 5/24 (2013.01); C08L 25/16 (2013.01); C08L 33/14 (2013.01); C08L 47/00 (2013.01); C08L 65/00 (2013.01); C08L 2201/02 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01); C08L 2312/02 (2013.01);
Abstract
A resin composition comprises a prepolymer of crosslinking agent and benzoxazine resin and a maleimide resin. The resin composition may be used to make various articles, such as a prepreg, a resin film, a resin-coated copper, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including laminate reflow shrinkage, T288 thermal resistance, ten-layer board T300 thermal resistance, dissipation factor, copper foil peeling strength, and resin filling property in open area.