The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Dec. 11, 2019
Applicant:

Impossible Objects Inc., Northbrook, IL (US);

Inventors:

Robert Swartz, Highland Park, IL (US);

Eugene Gore, Des Plaines, IL (US);

Buckley Crist, Wilmette, IL (US);

Assignee:

Impossible Objects, Inc., Northbrook, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/147 (2017.01); B29C 65/48 (2006.01); B32B 5/22 (2006.01); G03G 15/22 (2006.01); B32B 5/02 (2006.01); B32B 7/14 (2006.01); B32B 5/26 (2006.01); B32B 5/30 (2006.01); B29C 64/153 (2017.01); B32B 9/04 (2006.01); B32B 27/36 (2006.01); B32B 29/00 (2006.01); B32B 9/06 (2006.01); B32B 27/14 (2006.01); B32B 29/02 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 5/16 (2006.01); B32B 29/04 (2006.01); B32B 27/06 (2006.01); B32B 18/00 (2006.01); B32B 27/12 (2006.01); B32B 5/12 (2006.01); B32B 9/00 (2006.01); B29C 64/30 (2017.01); B29C 64/20 (2017.01); B29C 64/141 (2017.01); B29K 101/12 (2006.01); B29K 105/00 (2006.01); B33Y 40/00 (2020.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/147 (2017.08); B29C 64/141 (2017.08); B29C 64/153 (2017.08); B29C 64/20 (2017.08); B29C 64/30 (2017.08); B29C 65/486 (2013.01); B32B 5/02 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/12 (2013.01); B32B 5/16 (2013.01); B32B 5/22 (2013.01); B32B 5/26 (2013.01); B32B 5/30 (2013.01); B32B 7/14 (2013.01); B32B 9/005 (2013.01); B32B 9/045 (2013.01); B32B 9/047 (2013.01); B32B 9/048 (2013.01); B32B 9/06 (2013.01); B32B 18/00 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/12 (2013.01); B32B 27/14 (2013.01); B32B 27/36 (2013.01); B32B 29/002 (2013.01); B32B 29/005 (2013.01); B32B 29/02 (2013.01); B32B 29/04 (2013.01); G03G 15/224 (2013.01); B29K 2101/12 (2013.01); B29K 2105/0097 (2013.01); B29K 2105/251 (2013.01); B29K 2105/256 (2013.01); B32B 2250/20 (2013.01); B32B 2250/24 (2013.01); B32B 2250/26 (2013.01); B32B 2255/02 (2013.01); B32B 2255/04 (2013.01); B32B 2255/10 (2013.01); B32B 2255/12 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/025 (2013.01); B32B 2260/028 (2013.01); B32B 2260/04 (2013.01); B32B 2260/046 (2013.01); B32B 2262/02 (2013.01); B32B 2262/0261 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/06 (2013.01); B32B 2262/101 (2013.01); B32B 2262/103 (2013.01); B32B 2262/105 (2013.01); B32B 2262/106 (2013.01); B32B 2307/202 (2013.01); B32B 2307/50 (2013.01); B32B 2307/718 (2013.01); B32B 2307/726 (2013.01); B32B 2307/75 (2013.01); B32B 2605/08 (2013.01); B32B 2607/00 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); Y10T 428/2481 (2015.01); Y10T 428/24826 (2015.01); Y10T 428/24843 (2015.01);
Abstract

A three-dimensional object comprises substantially planar or flat substrate layers that are folded and stacked in a predetermined order and infiltrated by a hardened material. The object is fabricated by positioning powder on all or part of multiple substrate layers. On each layer, the powder is selectively deposited in a pattern that corresponds to tiles that each have a slice of the object. For each slice, powder is deposited in positions that correspond to positions in the slice where the object exists, and not deposited where the object does not exist. The tiles of each substrate layer are folded and aligned in a predetermined order. Multiple folded substrate layers mat be combined into a single stack. The powder is transformed into a substance that flows and subsequently hardens into the hardened material in a spatial pattern that infiltrates positive regions, and does not infiltrate negative regions, in the substrate layers.


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