The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Apr. 06, 2017
Applicant:

M Cubed Technologies, Inc., Newtown, CT (US);

Inventors:

Prashant G. Karandikar, Avondale, PA (US);

Michael K. Aghajanian, Newark, DE (US);

Edward Gratrix, Monroe, CT (US);

Brian J. Monti, Avon, CT (US);

Assignee:

M Cubed Technologies, Inc., Newton, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 53/017 (2012.01); B24B 53/12 (2006.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24B 53/12 (2013.01);
Abstract

A chemical-mechanical polishing/planarization pad conditioner body made from diamond-reinforced reaction bonded silicon carbide, with diamond particles protruding or 'standing proud' of the rest of the surface, and uniformly distributed on the cutting surface. In one embodiment, the diamond particles are approximately uniformly distributed throughout the composite, but in other embodiments they are preferentially located at and near the conditioning surface. The tops of the diamond particles can be engineered to be at a constant elevation (i.e., the conditioner body can be engineered to be very flat). Exemplary shapes of the body may be disc or toroidal. The diamond particles can be made to protrude from the conditioning surface by preferentially eroding the Si/SiC matrix. The eroding may be accomplished by electrical discharge machining or by lapping/polishing with abrasive.


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