The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 28, 2022

Filed:

Apr. 07, 2016
Applicant:

Idemitsu Unitech Co., Ltd., Tokyo, JP;

Inventors:

Ryo Katada, Chiba, JP;

Shuichi Goto, Chiba, JP;

Koji Kakigami, Chiba, JP;

Yoshinori Namba, Chiba, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/354 (2014.01); B31B 70/81 (2017.01); B29C 65/14 (2006.01); B23K 20/00 (2006.01); B31B 50/81 (2017.01); B65D 33/25 (2006.01); B65B 61/18 (2006.01);
U.S. Cl.
CPC ...
B23K 26/354 (2015.10); B23K 20/00 (2013.01); B29C 65/14 (2013.01); B31B 50/81 (2017.08); B31B 70/813 (2017.08); B65D 33/2508 (2013.01); B65B 61/188 (2013.01);
Abstract

A light-absorbing layer and a bonding layer are layered on a first side of each of a belt-shaped male base portion integrated with a male portion and a female base portion integrated with a female portion on a side of the male and female base portions opposite the first side. The light-absorbing layer contains a light-absorbing material having a wavelength absorption range from 800 nm to 1200 nm to absorb a laser beam of the range. The bonding layer contains a low-melting-point resin in a form of a metallocene linear low-density polyethylene having a melting point ranging from 60 degrees C. to 120 degrees C. When the zipper tape is bonded to the base film, the laser beam is applied to heat the light-absorbing layer to melt the bonding layer. The melted bonding layer is pressure-bonded to the base film. The base film can be bonded without causing thermal degradation.


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