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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11369985 B1

PDFFull Text
Date of Patent:
Jun. 28, 2022

Filed:

Oct. 04, 2019

Fluid conduits with heat shielding

Applicant:

Delavan Inc., West Des Moines, IA (US);

Inventors:

Jason Ryon, Carlisle, IA (US);

Lev A. Prociw, Johnston, IA (US);

Assignee:

Delavan Inc, West Des Moines, IA (US);

Attorneys:

Locke Lord LLP

Joshua L. Jones

Scott D. Wofsy

Primary Examiner:

Jacob J Cigna

Int. Cl.
CPC ...
B23P 15/26 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); F02C 7/22 (2006.01); F02C 7/24 (2006.01); B05B 15/14 (2018.01);
U.S. Cl.
CPC ...
B05B 15/14 (2018.02); B23P 15/26 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); F02C 7/222 (2013.01); F02C 7/24 (2013.01); F05D 2220/32 (2013.01); F05D 2230/60 (2013.01); Y10T 29/49361 (2015.01);
Abstract

A method includes forming fluid conduit inside a heat shield in an additive manufacturing process, removing powder from an interior passage of the fluid conduit and from an insulation gap defined between the fluid conduit and the heat shield, separating the heat shield and fluid conduit from the build platform, and shifting the fluid conduit to a shifted position relative to the heat shield. The method includes securing the fluid conduit to the heat shield in the shifted position.

Find Patent Forward Citations

Ryon, Jason. (2022). Fluid conduits with heat shielding (U.S. Patent No. 11369985). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11369985

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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