Implantable flexible neural microelectrode comb, and preparation method and implantation method therefor

Abstract

Disclosed are an implantable flexible neural microelectrode comb, and a preparation method and implantation method therefor. The flexible neural microelectrode comb is mainly composed of a flexible substrate layer (), a flexible insulation layer (), and a metal connection wire layer () arranged between the flexible substrate layer () and the flexible insulation layer (); the flexible neural microelectrode comb comprises a filament structure (), a mesh structure (), a plane structure () and a bonding pad area () connected in sequence; electrode sites () are arranged on the filament structure (); bonding pads are arranged on the bonding pad area (); the metal connection wire layer () is composed of metal connection wires connecting the electrode sites () and the bonding pads; and the flexible insulation layer () is not arranged on the surfaces of the electrode sites () and the bonding pads. The prepared flexible neural microelectrode comb has a structure gradually changing from a filament to a mesh to a plane structure, thus improving mechanical stability during a deformation process. The mechanical properties of the implantable flexible neural microelectrode comb match brain tissue, the implantation footprint is small, an inflammatory response of the brain is avoided, and electrophysiological signals in the brain can be stably tracked and measured in a multi-site manner for a long time.