The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Dec. 21, 2020
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Takanori Ito, Nagaokakyo, JP;

Morio Takeuchi, Nagaokakyo, JP;

Yukiya Yamaguchi, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/38 (2015.01); H04L 5/16 (2006.01); H04B 1/04 (2006.01); H04B 1/00 (2006.01); H04B 1/10 (2006.01);
U.S. Cl.
CPC ...
H04B 1/04 (2013.01); H04B 1/005 (2013.01); H04B 1/1009 (2013.01); H04B 1/1018 (2013.01); H04B 2001/0408 (2013.01);
Abstract

In a radio frequency module, the first inductor is disposed on the first principal surface of the mounting board and located on the first reception path through which a first reception signal of a first frequency passes, on an input side of the first low noise amplifier. The second inductor is disposed on the first principal surface of the mounting board and located on the second reception path through which a second reception signal of a second frequency lower than the first frequency passes, on an input side of the second low noise amplifier. The radio frequency component is disposed between the first inductor and the second inductor. A distance between the first inductor and the shielding layer is greater than a distance between the second inductor and the shielding layer. The first inductor overlaps the first low noise amplifier in a thickness direction of the mounting board.


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