The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Apr. 29, 2020
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Taegyu Kim, Gyeonggi-do, KR;

Kyungbae Ko, Gyeonggi-do, KR;

Un Kim, Gyeonggi-do, KR;

Sanguk Kim, Gyeonggi-do, KR;

Donghwan Kim, Gyeonggi-do, KR;

Yongsub Lee, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H05K 5/00 (2006.01); H05K 5/02 (2006.01); H05K 7/14 (2006.01); H05K 1/02 (2006.01); H01Q 1/50 (2006.01); H01Q 9/04 (2006.01); H01Q 1/48 (2006.01); H01Q 5/20 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/242 (2013.01); H01Q 1/48 (2013.01); H01Q 1/50 (2013.01); H01Q 5/20 (2015.01); H01Q 9/045 (2013.01); H05K 1/0243 (2013.01); H05K 5/0017 (2013.01); H05K 5/0217 (2013.01); H05K 7/1427 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10189 (2013.01);
Abstract

An electronic device includes a housing including a first plate disposed to be oriented in a first direction, a second plate disposed to be oriented in a second direction opposite the first direction, and a side member surrounding a space between the first plate and the second plate and coupled to or integrally formed with the second plate; a display visible through at least part of the first plate; a printed circuit board (PCB) disposed in the space and including a ground; a first conductive pattern disposed between the PCB and the second plate and including a first portion and a second portion spaced apart from the first portion; a second conductive connection member disposed between the second portion and the PCB; and a radio frequency (RF) communication circuit electrically connected with the first conductive connection member and configured to transmit or receive at least one signal having a predetermined frequency. The PCB may include a first conductive path electrically connecting the RF communication circuit and the first portion; a second conductive path electrically connecting a first position of the ground and the second portion; a third conductive path electrically connecting the first portion and a second position of the ground; and a fourth conductive path electrically connecting the first portion and a third position of the ground.


Find Patent Forward Citations

Loading…