The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Feb. 27, 2020
Applicant:

Ablic Inc., Chiba, JP;

Inventors:

Yohei Ogawa, Chiba, JP;

Hirotaka Uemura, Chiba, JP;

Assignee:

ABLIC INC., Chiba, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/06 (2006.01); G01R 33/07 (2006.01); H01L 43/04 (2006.01);
U.S. Cl.
CPC ...
H01L 43/065 (2013.01); G01R 33/077 (2013.01); H01L 43/04 (2013.01);
Abstract

A semiconductor device includes a semiconductor substrate having a surface perpendicular to the first direction; a vertical Hall element formed in the semiconductor substrate, and including a magnetosensitive portion having a depth in the first direction, a width in the second direction, and a length in the third direction; and an excitation wiring extending in the third direction and disposed above the semiconductor substrate and at a position that overlaps the center position of the width of the magnetosensitive portion, and the value u derived from Expression (1) is 0.6 or more: where W is the width of the magnetosensitive portion, Wc/2 is a distance from the center position of the width of the magnetosensitive portion to the first end surface closer thereto, and h is a distance from the center position of the depth of the magnetosensitive portion to the excitation wiring.


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