The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Jul. 16, 2015
Applicant:

Suzhou Lekin Semiconductor Co., Ltd., Taicang, CN;

Inventor:

Woo Sik Lim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/06 (2010.01); H01L 33/22 (2010.01); H01L 33/30 (2010.01); H01L 33/32 (2010.01); H01L 33/40 (2010.01); H01L 33/42 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 27/153 (2013.01); H01L 33/0093 (2020.05); H01L 33/06 (2013.01); H01L 33/22 (2013.01); H01L 33/30 (2013.01); H01L 33/32 (2013.01); H01L 33/405 (2013.01); H01L 33/42 (2013.01); H01L 33/44 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/382 (2013.01); H01L 2224/16245 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light-emitting device array according to an embodiment includes a plurality of light-emitting devices connected to each other, each of the light-emitting devices comprising a light-emitting structure comprising a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a (1-1)th electrode connected to the exposed first conductive semiconductor layer; a (1-2)th electrode connected to the second conductive semiconductor layer; (2-1)th and (2-2)th electrodes connected to the (1-1)th and (1-2)th electrodes, respectively; a first bonding layer disposed between the (1-1)th electrode and the (2-1)th electrode; and a second bonding layer disposed between the (1-2)th electrode and the (2-2)th electrode wherein the (2-1)th electrode of the first light-emitting device and the (2-2)th electrode of the second light-emitting device are integrated, and the (2-2)th electrode of the first light-emitting device and the (2-1)th electrode of the second light-emitting device are integrated.


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