The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Jul. 16, 2020
Applicant:
SK Hynix Inc., Icheon-si, KR;
Inventor:
Go Hyun Lee, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11556 (2017.01); H01L 25/065 (2006.01); G11C 16/08 (2006.01); H01L 27/11582 (2017.01); G11C 5/02 (2006.01); G11C 16/26 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11556 (2013.01); G11C 5/025 (2013.01); G11C 16/08 (2013.01); G11C 16/26 (2013.01); H01L 25/0657 (2013.01); H01L 27/11582 (2013.01);
Abstract
A semiconductor device having a three-dimensional (3D) structure is disclosed. The semiconductor device includes a first chip configured to include a logic circuit, and a second chip stacked on the first chip and configured to include a memory cell array. At least one transfer circuit for connecting a row line of the memory cell array to a global row line is distributed to each of the first chip and the second chip.