The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Oct. 21, 2020
Applicant:

Powerchip Semiconductor Manufacturing Corporation, Hsinchu, TW;

Inventors:

Shih-Ping Lee, Hsinchu, TW;

Shyng-Yeuan Che, Hsinchu County, TW;

Hsiao-Pei Lin, Miaoli County, TW;

Po-Yi Wu, Hsinchu, TW;

Kuo-Fang Huang, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10829 (2013.01); H01L 27/1087 (2013.01); H01L 27/10867 (2013.01); H01L 28/40 (2013.01); H01L 28/90 (2013.01); G09G 2300/0842 (2013.01);
Abstract

Provided is a memory structure including first and second transistors, an isolation structure, a conductive layer, and a capacitor. The first transistor and the second transistor are disposed on a substrate. Each of the first and second transistors includes a gate disposed on the substrate and two source/drain regions disposed in the substrate. The isolation structure is disposed in the substrate between the first and the second transistors. The conductive layer is disposed above the first transistor and the second transistor, and includes a circuit portion, a first dummy portion, and a second dummy portion, wherein the circuit portion is electrically connected to the first transistor and the second transistor, the first dummy portion is located above the first transistor, and the second dummy portion is located above the second transistor. The capacitor is disposed on the substrate and located between the first dummy portion and the second dummy portion.


Find Patent Forward Citations

Loading…