The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Nov. 14, 2017
Applicant:

Tazmo Co., Ltd., Okayama, JP;

Inventor:

Masaaki Tanabe, Okayama, JP;

Assignee:

TAZMO CO., LTD., Okayama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 21/6835 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75301 (2013.01); H01L 2224/75824 (2013.01); H01L 2224/75842 (2013.01);
Abstract

A bonder includes a first chuck unitA, a second chuck unitB, a first baseA, a second baseB, and a first floating mechanismA. The first chuck unitA and the second chuck unitB are chuck units in a pair including respective suction surfaces for suction of bonding targets and are arranged while respective suction surfacesandface each other. The first baseA and the second baseB support the first chuck unitA and the second chuck unitB respectively. The first floating mechanismA applies gas pressure to a back surfaceof the first chuck unitA to float the first chuck unitA from the first baseA, thereby moving the suction surfaceof the first chuck unitA toward the suction surfaceof the second chuck unitB.


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