The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Dec. 07, 2020
Applicant:
Cerebras Systems Inc., Los Altos, CA (US);
Inventor:
Jean-Philippe Fricker, Los Altos, CA (US);
Assignee:
Cerebras Systems Inc., Los Altos, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/5386 (2013.01); H01L 23/562 (2013.01); H01L 24/29 (2013.01); H01L 24/72 (2013.01); H01L 24/83 (2013.01); H01L 25/0655 (2013.01); H01L 2224/29186 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/831 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/351 (2013.01);
Abstract
An integrated circuit assembly that includes a semiconductor wafer having a first coefficient of thermal expansion; an electronic circuit substrate having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion; and an elastomeric connector arranged between the semiconductor wafer and the electronic circuit substrate and that forms an operable signal communication path between the semiconductor wafer and the electronic circuit substrate.