The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Oct. 15, 2018
Chengdu Boe Optoelectronics Technology Co., Ltd., Sichuan, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Hongwei Ma, Beijing, CN;
Youngyik Ko, Beijing, CN;
Tairong Kim, Beijing, CN;
Xiangdan Dong, Beijing, CN;
Jinsan Park, Beijing, CN;
Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan, CN;
BOE Technology Group Co., Ltd., Beijing, CN;
Abstract
The present application provides a method of bonding an integrated circuit chip to a display panel. The method includes forming a plurality of first bonding pads in a bonding region on a first side of the display panel; forming a plurality of vias extending through the display panel in the bonding region; subsequent to forming the plurality of vias, disposing an integrated circuit chip having a plurality of second bonding pads on a second side of the display panel substantially opposite to the first side, the plurality of second bonding pads being on a side of the integrated circuit chip proximal to the display panel; and electrically connecting the plurality of first bonding pads respectively with the plurality of second bonding pads by forming a plurality of connectors respectively in the plurality of vias.