The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
May. 15, 2020
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Ibrahim Ramez Chamas, Carlsbad, CA (US);
Mohamed Abouzied, La Jolla, CA (US);
Bhushan Shanti Asuri, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H03H 7/42 (2006.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/562 (2013.01); H01L 23/585 (2013.01); H01L 24/13 (2013.01); H03H 7/42 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/19051 (2013.01); H01L 2924/3512 (2013.01); H04B 1/40 (2013.01);
Abstract
An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.