The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Nov. 06, 2019
Applicant:
Daegu Gyeongbuk Institute of Science and Technology, Daegu, KR;
Inventors:
Kyung In Jang, Incheon, KR;
Ho Hyun Keum, Seoul, KR;
Jong Cheol Rah, Daegu, KR;
Seung Kyoung Heo, Hwaseong-si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 21/683 (2006.01); C09J 7/38 (2018.01); B32B 37/00 (2006.01); C09J 5/00 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 37/025 (2013.01); C09J 5/00 (2013.01); C09J 7/38 (2018.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); B32B 2457/00 (2013.01); C09J 2203/326 (2013.01); C09J 2301/502 (2020.08); H01L 2221/68363 (2013.01); H01L 2221/68386 (2013.01);
Abstract
A method of manufacturing an electronic device is provided. The method includes forming a stack structure by placing a to-be-peeled layer on a substrate, applying thermal shock to the stack structure, detaching the to-be-peeled layer from the substrate, and transferring the detached to-be-peeled layer to a target substrate.
Jang, Kyung. (2022). Method of manufacturing electronic device (U.S. Patent No. 11367647). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11367647
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile