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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11367557 B1

PDFFull Text
Date of Patent:
Jun. 21, 2022

Filed:

Dec. 16, 2019

Semiconductor chip having one or more on-chip metal winding and enclosed by top and bottom chip-external ferromagnetic cores

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Xin Zhang, Chappaqua, NY (US);

Todd Edward Takken, Brewster, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Alexander G. Jochym

Primary Examiner:

Ermias T Woldegeorgis

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01F 27/24 (2006.01); H01L 25/065 (2006.01); H01L 49/02 (2006.01); H01L 23/522 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01L 23/5227 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 28/10 (2013.01); H01F 2027/2809 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19042 (2013.01);
Abstract

The structure includes a semiconductor chip connected to a substrate via one or more solder balls. The semiconductor chip includes one or more on-chip metal winding. The structure includes a first ferromagnetic core. The first ferromagnetic core is located below the semiconductor chip and above the substrate. The structure includes a second ferromagnetic core. The second ferromagnetic core is located above the semiconductor chip. The first ferromagnetic core and the second ferromagnetic core create a magnetic loop.

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Quick Actions:

Zhang, Xin. (2022). Semiconductor chip having one or more on-chip metal winding and enclosed by top and bottom chip-external ferromagnetic cores (U.S. Patent No. 11367557). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11367557

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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