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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11367555 B1

PDFFull Text
Date of Patent:
Jun. 21, 2022

Filed:

Oct. 31, 2018

Mounting substrate

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Shingo Ito, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Shawki S Ismail

Assistant Examiner:

Kazi S Hossain

Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/06 (2006.01); H01F 41/04 (2006.01); H01F 27/29 (2006.01); H04R 9/00 (2006.01); H01F 17/00 (2006.01); H05K 1/16 (2006.01); B06B 1/04 (2006.01); H04R 9/06 (2006.01); H04R 31/00 (2006.01); H01F 27/28 (2006.01); H01F 41/26 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H01F 27/06 (2013.01); B06B 1/045 (2013.01); H01F 17/0013 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 41/04 (2013.01); H01F 41/041 (2013.01); H01F 41/26 (2013.01); H04R 9/00 (2013.01); H04R 9/06 (2013.01); H04R 31/00 (2013.01); H05K 1/16 (2013.01); H05K 1/165 (2013.01); H05K 3/24 (2013.01); H01F 2027/065 (2013.01); H05K 3/108 (2013.01); H05K 3/4661 (2013.01);
Abstract

A mounting substrate includes a resin layer and a first conductor including a contact surface in contact with the resin layer. The first conductor includes a first surface facing toward the mounting surface and a second surface on a side opposite to the first surface and extends in a direction parallel or substantially parallel to the mounting surface. The first conductor has a difference of a maximum value and a minimum value of a distance between the first surface and the mounting surface smaller than a difference of a maximum value and a minimum value of a distance between the second surface and the mounting surface. The resin layer includes a resin wall portion surrounding an opening portion partially exposing the first conductor on the mounting surface side, and the first conductor includes an exposed portion defining a mounting electrode.

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