The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Dec. 20, 2018
Applicant:
Mitsubishi Hitec Paper Europe Gmbh, Bielefeld, DE;
Inventors:
Dieter Becker, Georgsmarienhuette, DE;
Nadia El-Karzazi, Bielefeld, DE;
Konstantinos Kalessios, Frankfurt, DE;
Jochen Schlegel, Heroldsberg, DE;
Nora Wilke, Flensburg, DE;
Claas Boxhammer, Herford, DE;
Assignee:
MITSUBISHI HITEC PAPER EUROPE GMBH, Bielefeld, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D21H 27/00 (2006.01); D21H 19/44 (2006.01); C09J 7/40 (2018.01); D21H 19/42 (2006.01);
U.S. Cl.
CPC ...
D21H 27/001 (2013.01); C09J 7/401 (2018.01); C09J 7/403 (2018.01); D21H 19/42 (2013.01); D21H 19/44 (2013.01); C09J 2203/334 (2013.01); C09J 2400/283 (2013.01);
Abstract
A release substrate includes: a carrier substrate having a front side and a reverse side opposite the front side, and a release layer disposed on the front side and/or reverse side of the carrier substrate. The release layer includes a polymeric binder and a wax based on a vegetable oil.