The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Sep. 10, 2018
Applicant:
Heedae Park, Busan, KR;
Inventor:
Heedae Park, Busan, KR;
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); C08L 75/04 (2006.01); C08G 18/04 (2006.01); C09J 7/35 (2018.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); C08G 18/04 (2013.01); C08L 75/04 (2013.01); C09J 7/35 (2018.01); C08G 2170/20 (2013.01); C08J 2335/02 (2013.01); C08J 2367/00 (2013.01); C08J 2375/04 (2013.01); C08J 2377/00 (2013.01); C08K 3/36 (2013.01); C08K 2201/011 (2013.01); C09J 2301/304 (2020.08); C09J 2301/408 (2020.08); C09J 2431/00 (2013.01); C09J 2467/00 (2013.01); C09J 2475/00 (2013.01); C09J 2477/00 (2013.01);
Abstract
Disclosed is a nanosilica-containing thermoplastic hot-melt film having excellent bonding strength, which may be inserted between fabrics to adhere them to each other and may be distributed uniformly on the surfaces of both the fabrics without excessively penetrating into one of the fabrics after melting by heat and pressure during no-sew pressing even if the yarn density of the fabrics is high or low or even if the hole diameter of the fabrics is large or small, thereby increasing the bonding strength between the fabrics.