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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11364714 B1

PDFFull Text
Date of Patent:
Jun. 21, 2022

Filed:

Oct. 08, 2014

Fluororesin base material, printed wiring board, and circuit module

Applicants:

Sumitomo Electric Printed Circuits, Inc., Koka, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Satoshi Kiya, Koka, JP;

Sumito Uehara, Koka, JP;

Kousuke Miura, Koka, JP;

Makoto Nakabayashi, Osaka, JP;

Assignees:

SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Koka, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Attorney:

Faegre Drinker Biddle & Reath LLP

Primary Examiner:

Monique R Jackson

Int. Cl.
CPC ...
B32B 27/32 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01); B32B 7/12 (2006.01); H05K 3/20 (2006.01); B32B 27/30 (2006.01); H05K 1/02 (2006.01); H05K 3/28 (2006.01); H05K 3/06 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/322 (2013.01); B32B 7/12 (2013.01); B32B 27/304 (2013.01); H05K 1/0274 (2013.01); H05K 1/034 (2013.01); H05K 3/20 (2013.01); H05K 3/386 (2013.01); H05K 3/389 (2013.01); B32B 2457/08 (2013.01); H05K 1/024 (2013.01); H05K 1/0366 (2013.01); H05K 3/007 (2013.01); H05K 3/067 (2013.01); H05K 3/281 (2013.01); H05K 3/285 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0158 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/09781 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/0264 (2013.01); H05K 2203/0278 (2013.01); H05K 2203/0376 (2013.01); H05K 2203/0769 (2013.01); H05K 2203/1173 (2013.01);
Abstract

A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.

Find Patent Forward Citations

Kiya, Satoshi. (2022). Fluororesin base material, printed wiring board, and circuit module (U.S. Patent No. 11364714). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11364714

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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