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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11364690 B1

PDFFull Text
Date of Patent:
Jun. 21, 2022

Filed:

Jan. 30, 2019

Resin-based composite structure and method for forming resin-based composite structure

Applicant:

Giant Manufacturing Co., Ltd., Taichung, TW;

Inventors:

Yao-Tun Chiang, Taichung, TW;

Chih-Kai Chang, Taichung, TW;

Ching-Yao Lin, Taichung, TW;

Assignee:

GIANT MANUFACTURING CO., LTD., Taichung, TW;

Attorney:

CKC & Partners Co., LLC

Primary Examiner:

Arti Singh-Pandey

Int. Cl.
CPC ...
B29C 70/34 (2006.01); B32B 27/08 (2006.01); B32B 27/34 (2006.01); B32B 27/28 (2006.01); B32B 27/38 (2006.01); B29C 70/02 (2006.01); B29C 70/08 (2006.01); B29C 70/42 (2006.01); B29C 63/00 (2006.01); C08J 5/24 (2006.01); B29L 31/30 (2006.01); B32B 5/02 (2006.01); B32B 27/12 (2006.01);
U.S. Cl.
CPC ...
B29C 70/34 (2013.01); B29C 63/0017 (2013.01); B29C 70/021 (2013.01); B29C 70/086 (2013.01); B29C 70/42 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/28 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/34 (2013.01); B32B 27/38 (2013.01); C08J 5/24 (2013.01); B29L 2031/3091 (2013.01); B32B 2262/106 (2013.01); B32B 2605/00 (2013.01);
Abstract

A method for forming a resin-based composite structure is provided. The method includes: providing a prepreg layup, wherein the prepreg layup includes an epoxy resin-carbon fiber composite material; covering a thermal-fusion material on a surface of the prepreg layup; and performing a molding and curing process to fuse the thermal-fusion material with the prepreg layup. Wherein the molding and curing process includes: heating at a first temperature to melt, soften and fully fuse the thermal-fusion material with the prepreg layup; and heating at a second temperature to solidify the thermal-fusion material for forming the resin-based composite structure. Wherein the first temperature is lower than the second temperature.

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