The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 21, 2022

Filed:

Apr. 10, 2018
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Sergio Gonzalez, Sant Cugat del Valles, ES;

Matthew A Shepherd, Vancouver, WA (US);

Scott White, Boise, ID (US);

Barret Kammerzell, Vancouver, WA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/393 (2017.01); B33Y 50/02 (2015.01); G06T 17/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B33Y 50/02 (2014.12); G06T 17/00 (2013.01);
Abstract

In an example implementation, a method of compensating for dimensional variation in 3D printing includes receiving a 3D object model that represents a 3D part to be printed. The method also includes receiving a build material type and a position for printing the 3D part within a build volume. The method includes determining from the position, target subvolumes of the build volume into which the 3D part is to be printed, retrieving a dimensional compensation factor associated with each target subvolume, and then applying each dimensional compensation factor to the 3D object model to scale the 3D part according to the position of the 3D part within the build volume.


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