The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Nov. 13, 2017
Applicant:
General Electric Company, Schenectady, NY (US);
Inventors:
Justin Mamrak, Loveland, OH (US);
MacKenzie Ryan Redding, Mason, OH (US);
Mark Kevin Meyer, Dayton, OH (US);
Assignee:
General Electric Company, Schenectady, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 15/00 (2006.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B23K 26/342 (2014.01); B23K 15/08 (2006.01); B23K 26/082 (2014.01); B23K 26/14 (2014.01); B33Y 70/00 (2020.01);
U.S. Cl.
CPC ...
B23K 15/0086 (2013.01); B23K 15/08 (2013.01); B23K 26/082 (2015.10); B23K 26/14 (2013.01); B23K 26/342 (2015.10); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12);
Abstract
The present disclosure generally relates to methods and apparatuses for additive manufacturing using foil-based build materials. Such methods and apparatuses eliminate several drawbacks of conventional powder-based methods, including powder handling, recoater jams, and health risks. In addition, the present disclosure provides methods and apparatuses for compensation of in-process warping of build plates and foil-based build materials, in-process monitoring, and closed loop control.