The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Apr. 30, 2018
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Andy Van Brocklin, Corvallis, OR (US);
Jay Shields, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/4099 (2006.01); B22F 10/85 (2021.01); B33Y 50/02 (2015.01); B28B 17/00 (2006.01);
U.S. Cl.
CPC ...
B22F 10/85 (2021.01); B28B 17/0081 (2013.01); B33Y 50/02 (2014.12); G05B 19/4099 (2013.01); G05B 2219/35134 (2013.01); G05B 2219/49023 (2013.01);
Abstract
Three-dimensional (3D) printing may be described as an additive manufacturing process for generating 3D components. A 3D model may be used by a 3D printer to print the 3D component. In 3D printing, successive layers of material may be utilized to generate the 3D component. As part of the 3D printing process, the 3D component may be subjected to sintering. In some cases, the sintering may be accomplished by subjecting the 3D component to a heat source, or other types of processes.