The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2022
Filed:
Jan. 18, 2019
Applicant:
Vitesco Technologies Germany Gmbh, Hannover, DE;
Inventor:
Johannes Bock, Munich, DE;
Assignee:
Vitesco Technologies Germany GmbH, Hannover, DE;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/28 (2013.01); H05K 1/0296 (2013.01); H05K 3/4644 (2013.01); H05K 3/0044 (2013.01); H05K 2201/09036 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/1327 (2013.01);
Abstract
A printed circuit board for an electric component contains an electrically insulating substrate which has a surface and at least one electrically conductive conductor track formed within the substrate. The surface of the substrate has a sealing region which is arranged and/or configured such that the sealing region is flat and/or the substrate has a homogenous substrate thickness in the sealing region. An overmolding which adjoins the sealing region is arranged on the surface of the substrate.