The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Mar. 16, 2021
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Mingzhu Wang, Ningbo, CN;

Zhenyu Chen, Ningbo, CN;

Nan Guo, Ningbo, CN;

Takehiko Tanaka, Ningbo, CN;

Bojie Zhao, Ningbo, CN;

Zilong Deng, Ningbo, CN;

Assignee:

NINGBO SUNNY OPOTECH CO., LTD., Zhejiang Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); B29C 45/14 (2006.01); B29C 33/44 (2006.01); G02B 19/00 (2006.01); G02B 7/10 (2021.01); B29C 70/72 (2006.01); B29C 70/88 (2006.01); G02B 13/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); B29C 43/18 (2006.01); B29C 43/36 (2006.01); B29C 43/52 (2006.01); G02B 7/02 (2021.01); B29L 31/34 (2006.01); B29C 45/40 (2006.01); B29C 45/00 (2006.01); B29D 11/00 (2006.01); B29L 31/00 (2006.01); B29K 101/12 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2257 (2013.01); B29C 33/44 (2013.01); B29C 43/18 (2013.01); B29C 43/36 (2013.01); B29C 43/52 (2013.01); B29C 45/14336 (2013.01); B29C 45/14467 (2013.01); B29C 45/14655 (2013.01); B29C 70/72 (2013.01); B29C 70/88 (2013.01); G02B 7/022 (2013.01); G02B 7/10 (2013.01); G02B 13/0085 (2013.01); G02B 19/0014 (2013.01); G02B 19/0076 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/284 (2013.01); B29C 45/0025 (2013.01); B29C 45/14819 (2013.01); B29C 45/40 (2013.01); B29D 11/00807 (2013.01); B29K 2101/12 (2013.01); B29K 2995/0003 (2013.01); B29K 2995/0018 (2013.01); B29L 2031/3425 (2013.01); B29L 2031/3437 (2013.01); B29L 2031/764 (2013.01); H05K 2201/10121 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01); Y02P 70/50 (2015.11);
Abstract

A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.


Find Patent Forward Citations

Loading…