The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Dec. 30, 2020
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Ion C. Tesu, Austin, TX (US);

James E. Heckroth, Austin, TX (US);

Stefan N. Mastovich, Austin, TX (US);

John N. Wilson, Austin, TX (US);

Krishna Pentakota, Austin, TX (US);

Michael Ireland, Surrey, GB;

Greg Ridsdale, Austin, TX (US);

Lyric Jackson, Pflugerville, TX (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 3/00 (2006.01); H03K 17/0812 (2006.01); H03K 17/16 (2006.01); H03K 17/687 (2006.01); H03K 3/012 (2006.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H03K 3/012 (2013.01); H02P 27/08 (2013.01);
Abstract

A method for driving a high-power drive device includes providing a signal having a first predetermined signal level to an output node during a first phase of a multi-phase transition process. The method includes generating a first indication of a first parameter associated with the signal provided to the output node. The method includes generating a second indication of a second parameter associated with the signal provided to the output node. The method includes providing the signal having a second predetermined signal level to the output node during a second phase of the multi-phase transition process. The method includes transitioning from the first phase to the second phase based on the first indication and the second indication. A multi-die, distributed package technique addresses power dissipation requirements for a driver product based on size and associated power dissipation needs of the high-power drive device in a target application.


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