The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

May. 14, 2020
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Toshihisa Yamamoto, Kariya, JP;

Hiroyasu Sugiura, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H02K 11/33 (2016.01); H02K 3/50 (2006.01); H02K 11/40 (2016.01); B62D 5/04 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H02K 11/33 (2016.01); B62D 5/0406 (2013.01); B62D 5/046 (2013.01); H02K 3/50 (2013.01); H02K 11/40 (2016.01); H05K 1/02 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 1/183 (2013.01); H05K 1/184 (2013.01); H05K 1/185 (2013.01); H02K 2211/03 (2013.01); H05K 2201/1009 (2013.01);
Abstract

An electronic apparatus includes a wiring board. The wiring board includes a wiring and a through-hole and is provided by dividing a multi-board providing board into the wiring board. The electronic apparatus further includes a circuit component having a surface mounting structure, mounted to the wiring board, and electrically connected to the wiring. A side wall of the wiring board has a cut portion that is provided when cutting and dividing the multi-board providing board. In the wiring board, the through-hole is formed adjacent to the cut portion without arranging the circuit component between the cut portion and the through-hole.


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