The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Jan. 15, 2021
Applicant:

Conquer Electronics Co., Ltd., New Taipei, TW;

Inventors:

Hung-Chih Chiu, New Taipei, TW;

Po-Shuo Chiu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 69/02 (2006.01); H02H 3/08 (2006.01); H01H 85/02 (2006.01);
U.S. Cl.
CPC ...
H02H 3/08 (2013.01); H01H 85/0241 (2013.01); H01H 69/022 (2013.01); H01M 2200/103 (2013.01);
Abstract

A protective element has a body, an inner connection layer, an outer connection layer, a heating layer and a low-melting-point alloy layer. The body is made of a single insulation material. The inner and outer connection layers are formed on two upper and lower surfaces of the body. The low-melting-point alloy layer is formed on the upper surface of the body and is electrically connected to the inner connection layer. The heating layer is mounted inside the body and is electrically connected to the low-melting-point alloy layer by the inner connection layer. The outer connection layer is electrically connected to the low-melting-point alloy layer and the heating layer. The outer connection layer is soldered on a power circuit. When the power circuit encounters overcurrent, the heating layer is heated to fuse the low-melting-point alloy layer faster. Thus, power circuit is cut to protect the power circuit.


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