The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Sep. 05, 2017
Applicant:

Institute of Physics, Chinese Academy of Sciences, Beijing, CN;

Inventors:

Zhou Jin, Beijing, CN;

Hailong Yu, Beijing, CN;

Xuejie Huang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/36 (2006.01); H01M 4/134 (2010.01); H01M 4/38 (2006.01); H01M 4/62 (2006.01); H01M 10/0525 (2010.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/366 (2013.01); H01M 4/134 (2013.01); H01M 4/386 (2013.01); H01M 4/626 (2013.01); H01M 4/628 (2013.01); H01M 10/0525 (2013.01); H01M 2004/021 (2013.01); H01M 2004/027 (2013.01);
Abstract

This invention relates to a double layer composite-coated nano-silicon negative electrode material, and its preparation methods and use, the negative electrode material comprising: a silicon-based nanoparticle, a copper layer coated on the surface of the silicon-based nanoparticle, and a conductive protective layer coated on the surface of the copper layer. Nano-copper has superplastic ductility and conductivity, and the prior art has proved that lithium ions can penetrate nano-copper; therefore, the copper coating layer has effects of inhibiting the volume expansion of the silicon-based nanoparticle and keeping the silicon-based nanoparticle from cracking so that direct contact between the silicon-based nanoparticle and an electrolyte is effectively avoided and a stable SEI is formed, and increasing the conductivity of the electrode. The surface of the nano-copper is coated with a further conductive protective layer to effectively inhibit the oxidation of the nano-copper, thereby improving the electrochemical performance.


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