The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

May. 30, 2019
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Marc A. Baldo, Lexington, MA (US);

Tony Wu, Boston, MA (US);

Markus Einzinger, Brighton, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/42 (2006.01); H01L 51/00 (2006.01); H01L 51/44 (2006.01); H01L 31/0224 (2006.01); H01L 31/055 (2014.01);
U.S. Cl.
CPC ...
H01L 51/422 (2013.01); H01L 31/022441 (2013.01); H01L 31/055 (2013.01); H01L 51/001 (2013.01); H01L 51/0052 (2013.01); H01L 51/0054 (2013.01); H01L 51/4213 (2013.01); H01L 51/441 (2013.01); H01L 51/445 (2013.01); H01L 51/448 (2013.01);
Abstract

Embodiments related to interlayers (e.g., interlayers comprising a transition metal oxide, a transition metal oxynitride, and/or a transition metal nitride) and associated systems, devices (e.g., photovoltaic devices), and methods are disclosed. In some embodiments, a system for exciton transfer includes a substrate including an inorganic semiconductor. An interlayer may be disposed on the substrate, and a layer including a material that undergoes singlet exciton fission when exposed to electromagnetic radiation may be disposed on the interlayer. The interlayer may be disposed between the substrate and the layer. In some embodiments, a method for manufacturing a system for exciton transfer involves depositing an interlayer onto a substrate that includes an inorganic semiconductor. The method may also include depositing a layer including a material that undergoes singlet exciton fission when exposed to electromagnetic radiation onto the interlayer.


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