The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Mar. 30, 2020
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventor:

Rajendra D. Pendse, Fremont, CA (US);

Assignee:

FACEBOOK TECHNOLOGIES, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); G02B 27/01 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/644 (2013.01); G02B 27/017 (2013.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 33/642 (2013.01);
Abstract

Disclosed herein are techniques for managing the thermal resistance and the planarity of a display package. According to certain embodiments, a device includes a display package having a molding compound; a plurality of light emitting diode (LED) dies arranged on a top surface of the display package, wherein each LED die of the plurality of LED dies includes a plurality of LEDs; a backplane die embedded within the molding compound of the display package, wherein the backplane die is electrically coupled to each LED die of the plurality of LED dies; and at least one spacer structure embedded within the molding compound of the display package. The backplane die and the at least one spacer structure together provide mechanical support and planar alignment for the plurality of LED dies arranged on the top surface of the display package. The at least one spacer structure has a first thermal conductivity, and the molding compound has a second thermal conductivity lower than the first thermal conductivity.


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