The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Aug. 27, 2019
Applicant:

Fujifilm Business Innovation Corp., Tokyo, JP;

Inventors:

Junichiro Hayakawa, Kanagawa, JP;

Akemi Murakami, Kanagawa, JP;

Hideo Nakayama, Kanagawa, JP;

Tsutomu Otsuka, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); F21V 8/00 (2006.01); G02B 6/02 (2006.01); H01L 33/10 (2010.01); H01L 33/14 (2010.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); G02B 6/0073 (2013.01); G02B 6/02076 (2013.01); H01L 33/10 (2013.01); H01L 33/14 (2013.01); G02B 6/4202 (2013.01);
Abstract

A light emitting element array includes a single semiconductor substrate, a plurality of semiconductor elements, which are formed on the single semiconductor substrate, and each of the semiconductor elements including a first distributed Bragg-reflector, an active layer formed over the first distributed Bragg-reflector, and a second distributed Bragg-reflector formed over the active layer. The array includes an electrode pad formed over the second distributed Bragg-reflector and a wiring formed at least partly over the second distributed Bragg-reflector and extending from the electrode pad toward the semiconductor elements. The semiconductor elements include a first semiconductor element, configured to emit laser light, and a second semiconductor element configured not to emit laser light and disposed at a position which is shorter distance along the wiring from the electrode pad than a distance along the wiring from the electrode pad to a position of the first semiconductor element.


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