The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Jul. 21, 2020
Applicant:

SK Hynix Inc., Icheon-si, KR;

Inventors:

Byung Jun Bang, Icheon-si, KR;

Sun Kyu Kong, Icheon-si, KR;

Assignee:

SK hynix Inc., Icheon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 24/45 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01);
Abstract

A memory package includes a package substrate including power wiring and ground wiring. The memory package also includes a memory controller disposed over an upper surface of the package substrate and electrically connected to the power wiring and the ground wiring. The memory package further includes a memory chip disposed over the memory controller and electrically connected to the power wiring and the ground wiring. The memory package additionally includes a band pass filter disposed at one side of the memory controller over the upper surface of the package substrate and including an inductor and a capacitor which are connected in series. The inductor and the capacitor connected in series are electrically connected between the power wiring and the ground wiring.


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