The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

May. 27, 2020
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Chun-Kai Liu, Hsinchu, TW;

Yao-Shun Chen, Xinpu Township, TW;

Po-Kai Chiu, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H05K 7/20 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/3107 (2013.01); H01L 23/3736 (2013.01); H01L 23/4334 (2013.01); H01L 24/32 (2013.01); H05K 7/209 (2013.01); H01L 24/19 (2013.01); H01L 24/82 (2013.01); H01L 2224/29099 (2013.01);
Abstract

A power module including a circuit board, a chip, a first heat-conduction and insulation substrate and a second heat-conduction and insulation substrate is provided. The circuit board includes a board and a metal block embedded in the board and exposed from a first surface and a second surface of the board opposite to one another. The chip is disposed on a side of the second surface of the board corresponding to the metal block, and the chip is electrically and thermally connected to the metal block. The first heat-conduction and insulation substrate is located on a side of the first surface of the board to be disposed on the circuit board. The second heat-conduction and insulation substrate is electrically and thermally connected to the chip.


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