The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 14, 2022

Filed:

Jan. 05, 2021
Applicant:

Government of the United States, As Represented BY the Secretary of the Air Force, Wright-Patterson AFB, OH (US);

Inventors:

Michael R. Snure, Oakwood, OH (US);

Eric W. Blanton, Dayton, OH (US);

Jeff L. Brown, Fairborn, OH (US);

Albert M. Hilton, Centerville, OH (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7806 (2013.01); H01L 21/6836 (2013.01); H01L 2221/68368 (2013.01);
Abstract

A method for making a selective-area lift-off thin film comprises depositing a van der Waals (vdW) buffer on a substrate; depositing a thin film material (or device structure) on the van der Waals buffer; depositing an adhesion layer on the thin film material; forming a stressor layer on top of the thin film layer; and bonding a handle layer to the stressor layer. Force may be applied to the layered structure by one or more of rolling, bending, and shearing. The area selected for lift-off may be defined by one of laser cutting and mechanical scribing. The vdW buffer includes one or more of hBN, graphite, and graphene. The handle layer is a one of a polyimide tape, thermal release tape, UV release tape, water- or solvent-soluble tape, Kapton tape, and Scotch tape. The stressor layer is a metal film, e.g. Ni, Cr, Ti.


Find Patent Forward Citations

Loading…